Chip Test Team Lead

Job Summary We are seeking a highly strategic and accomplished Team Lead of ATE Test & Product to provide executive leadership and oversight for the entire product lifecycle from silicon validation through high-volume manufacturing and field reliability. This key role is responsible for driving the overall test strategy, optimizing product yields and cost, and ensuring world-class product quality and reliability across all Arbe semiconductor product lines. The Director will manage three distinct but interdependent functional teams: ATE Test Engineering, Product Engineering, and Quality & Reliability (QRE). Key Responsibilities Executive Leadership & Strategy Define and execute the long-term ATE test strategy and roadmap, ensuring alignment with R&D, operations, and business goals across all product generations. Develop and foster a culture of technical excellence, data-driven decision-making, and continuous improvement. Serve as a key technical liaison, reporting on product quality, yield performance, test cost, and reliability metrics. ATE Test Engineering & Product Engineering Oversight Direct the ATE Test Engineering team to deliver robust, high-coverage, and cost-effective test programs for wafer probe and final test on multiple ATE platforms (e.g., Teradyne UltraFLEX, Advantest V93K, RF Testers). Lead the Product Engineering team in driving significant yield improvement and cost reduction initiatives (e.g., test time reduction, multi-site efficiency, limit tightening) to meet COGS targets. Establish and implement best practices for Design for Test (DFT) and Design for Manufacturing (DFM) in collaboration with Design Engineering. Oversee complex failure analysis (FA) and root cause corrective action (RCCA) processes for engineering and production yield issues. Quality & Reliability (QRE) Leadership Direct the Quality and Reliability Engineering (QRE) to define and execute comprehensive qualification plans (e.g., HTOL, HAST, ESD, Latch-up) according to industry standards (e.g., JEDEC, AEC-Q100). Ensure rigorous processes are in place for process change management, material disposition, and supplier quality. Be the final approver for all product release qualifications and ensure the product meets all internal and customer-specific quality and reliability requirements. Monitor field return data and drive cross-functional teams to implement corrective actions to improve Mean Time Between Failures (MTBF) and overall customer satisfaction. Qualifications Required Batchler or Master’s degree in Electrical Engineering, Computer Engineering, or a related field. Minimum of 10 years of experience in the semiconductor industry across ATE Test and Product Engineering. Minimum of 5 years of experience managing multi-disciplinary engineering teams (Test, Product, Quality, or similar functions) in a senior leadership position. Understanding of semiconductor physics, yield ramp, statistical process control (SPC), and quality systems (ISO, AEC-Q100). Proven expertise in defining and executing strategies for high-volume manufacturing (HVM) yield entitlement and cost optimization. Preferred Experience with specific market segments (e.g., Automotive, Industrial, Data Center, RF). Familiarity with advanced packaging technologies and their impact on test and reliability. Knowledge of advanced data analytics tools for large-scale production data (e.g., Spotfire, Tableau). Responsibilities null Requirements null Preferred Qualifications null